发明名称 WAFER CONVEYING APPARATUS OF EMICONDUCTOR DEVICE HAVING ARRANGEMENT DEVICE
摘要 PURPOSE: A wafer conveying apparatus of a semiconductor device having an arrangement device is provided to prevent the wafer from being broken down by using a wafer-conveying fork. CONSTITUTION: A wafer conveying apparatus comprises a supporter(100) which does not make contact with a wafer. The supporter(100) has a flat shape. A wafer resting portion(104) is connected to the supporter(100). The wafer resting portion(104) is provided with a jaw having a predetermined height. The wafer is inserted into a wafer insertion portion(106). A robot arm connection portion(110) is connected to one end of the supporter(100). A fork leveling device(102) is provided to correct the space between forks. The fork leveling device(102) is formed by cutting a side portion of the supporter(100) which is vertical to the robot arm connecting portion(110).
申请公布号 KR20000060207(A) 申请公布日期 2000.10.16
申请号 KR19990008338 申请日期 1999.03.12
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 KIM, SEONG EUN;PARK, CHUNG BAE;SON, YONG UN;WON, JONG GUK
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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