发明名称 |
Chipboard or laminated board hot pressed - using dielectric heating and supporting air cushion to minimise losses |
摘要 |
<p>A method of making pressed chipboard, fibre board or laminated wood board out of a mixt of wood particles and thermosetting binding agent consists of continuously feeding this mixt through heating, pressing and hardening stages. The mixt is formed into a layer of material, which is then pressed to a predetermined thickness and, after pressing, is dielectrically heated to harden the binding agent. Pref. the layer of material is conveyed between upper and lower endless belts to a pressing device which determines the required thickness and then between a pair of plates, spaced apart, which are subject to a flow of pressurised fluid which applies the belts onto the layer of material while the binding agent hardens.</p> |
申请公布号 |
DE2420174(A1) |
申请公布日期 |
1974.11.21 |
申请号 |
DE19742420174 |
申请日期 |
1974.04.25 |
申请人 |
SOUTHAMPTON MANUFACTURING CO., INC., RICHMOND, VA. (V.ST.A.) |
发明人 |
CAMP III, STAFFORD V., COUTLAND, VA. (V.ST.A.) |
分类号 |
B27N3/24;B30B5/06;(IPC1-7):29J5/00 |
主分类号 |
B27N3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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