| 摘要 |
PURPOSE: A treatment method is provided to remarkably reduce fabricating cost of a mounted part by plating the electrically connected area of a mounted part with a metal which is cheaper than gold. CONSTITUTION: A plurality of wire bonding pad(PW) are arranged in a shape of ring in the upper side of a PCB(B). A ground pad(PB) is arranged in the upper left side. In the lower side of the PCB(B), solder ball pads(PS) are arranged in the lattice structure. A metal film is electroplated on the surface of each of the pads(PW,PG,PS). Here, metals for the metal film includes palladium, silver, tin, indium, or alloys thereof which are cheaper than gold.
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