PURPOSE: A cleaning liquid for a wafer cleaning including a maleic acid having a carboxyl is provided to use as a new RCA-2 replacement chemicals and a spin scrubbing solution without giving a damage to a worker or an environment and simultaneously maximize the capacity for removing a particle and a metal impurity on a wafer. CONSTITUTION: The cleaning liquid consists of a maleic acid having a carboxyl and a mixture including a distilled water. The mixture further includes a surfactant.
