发明名称 |
A METHOD FOR FORMING METLLZED PATTERNS ON THE TOP SURFACE OF A PRINTED CIRCUIT BOARD |
摘要 |
Pads which are attached to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. A plurality of pads are formed on a carrier sheet so that each of the pads have a copper layer proximate to the carrier sheet and a joining metal layer formed on top of said copper layer. The plurality of pads are positioned on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, the pads bing laminated to the through-holes on the top surface using the joining metal, and the carrier sheet being separated from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may possess a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of an external dielectric surface. |
申请公布号 |
KR100268742(B1) |
申请公布日期 |
2000.10.16 |
申请号 |
KR19960044051 |
申请日期 |
1996.10.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION. |
发明人 |
KRESGE, JOHN STEVEN;LIGHT, DAVID NOEL |
分类号 |
H05K3/34;H05K1/11;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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