| 摘要 |
PURPOSE: A printed circuit board both side mounted method and a jig thereby are provided to perform a batch wave soldering by installing a printed circuit board, in which a heterotype component is inserted, on a jig. CONSTITUTION: A solder paste is printed on a copper film pad of a substrate by using a squeeze or the likes. Leads of upper surface components, such as a semiconductor integrated circuit and electronic components are mounted on the printed copper pad. And then a reflow soldering is proceeded with. The solder paste printed on the film pad is fused and soldered. Thereafter, the substrate is turned over, and the above process is repeated. To be specific, lower surface components are mounted and contacted on both surfaces of the printed circuit board. A heterotype component such as a connector(8) is inserted into the upper surface of the substrate. The substrates is placed on the jig(13). The components which are installed on the lower surface of the substrate are received by a space part(10) of the jig and sealed. The lead part of the heterotype component(8) which is installed on the lower surface of the substrate is positioned on a hole part(12) of the jig(13). The jig(13) having the substrate thereon is put into a reservoir in which the fused solder is accommodated, so as to perform a batch wave soldering with respect to the heterotype component(8).
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