METHOD FOR PROTECTING GOLDEN PLATES IN PCBS FROM BEING CONTAMINATED

摘要

PURPOSE: A method for preventing a gold plated terminal part of printed circuit board from being contaminated is provided to prevent contamination of a gold plated terminal part due to gas floating matter or the likes generated at a point of wave soldering or flux penetration as well as preventing a lead from being fused on the gold plated terminal part during the soldering process. CONSTITUTION: A vinyl synthetic resin is manufactured by adding a material having a coagulable masking solution(40), for example, poly vinyl chloride, poly vinyl acetate, etc., to gold plated terminal parts(10a) of a printed circuit board(10). A vinyl solution is manufactured by bringing the vinyl synthetic resin into solution by heat. The vinyl solution is coated by using a coating unit like a brush(30). The coagulable masking solution(40) is coated on all the gold plated terminal parts(10a) of the printed circuit board(10) since the printed circuit part(10) generally has the gold plated terminal parts(10a) on both side surfaces thereof. The coagulable masking solution is dried to be coagulated, thereby forming a film, in other words, a strip mask on the gold plated terminal parts(10a).