SEMICONDUCTOR LEAD FRAME HAVING MULTI-PLATING LAYER

摘要

PURPOSE: A semiconductor lead frame having multi plating layers and method for manufacturing the same are provided to improve the structure of the multi plating layer formed on the surface of the substrate. CONSTITUTION: The semiconductor lead frame includes a metal substrate(30), a nickel or Nickel alloy layer(31), a palladium or palladium alloy layer(32) and a ruthenium or ruthenium alloy layer(33). The nickel or Nikel alloy layer is formed on the metal substrate. The palladium or palladium alloy layer is formed on the nikel or Nikel alloy layer. The ruthenium or ruthenium alloy layer is formed on the palladium or palladium alloy layer.