DUAL CMP PAD CONDITIONER

摘要

According to an example embodiment, the present invention is directed to a CMP polishing apparatus (100) having at least two conditioning arms (110+120) for use in conditioning a polishing pad (150). The CMP polishing apparatus includes a first pad conditioner (130) configured and arranged both to dispense slurry and to condition the pad. A second pad conditioner (140) is configured and arranged both to clean a portion of the polishing pad (150) and to dispense cleaning chemicals. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.