Chip module for chip card has electrical component and contact bridge on one side of module carrier each coupled to contact surfaces on opposite side of module carrier via respective openings in latter

摘要

The chip module (1) has a module carrier (2) with contact surfaces (3) on one side and at least one electrical component (4) on its opposite side, contacting the contact surfaces via openings (5) in the module carrier. At least one contact bridge (10) is provided on the same side of the module carrier as the electrical component, with both its ends (12,13) projecting through openings (11) in the module carrier, for contacting the contact surfaces. Also included are Independent claims for the following; (a) a chip card; (b) a manufacturing method for a chip module