| 摘要 |
The invention relates to a method for mounting and electrically contacting a power semiconductor component having a metallic heat sink (15a, 17a) serving as support for the semiconductor chip and serving simultaneously as a heat dissipation element and a terminal contact (23) for the semiconductor chip and having at least one more electrical terminal contact (23) for contacting the semiconductor chip, wherein the heat sink (15a, 17a) is mechanically and electrically connected to a terminal contact area (5a, 7a) of a printed conductor (5, 7) by laser welding. The invention also relates to an electrical unit having at least one power semiconductor component correspondingly connected to the printed conductors. |
