| 摘要 |
A method of hybrid integration of optical and electronic device (1, 2) is disclosed. Optical waveguides (20) and electrical interconnections (17) are formed on a substrate (11) coated with a photosensitive core layer (13) sandwiched between an inner cladding layer (12) and outer cladding layer (14), after mounting the devices (1, 2) within one or more recesses (16) carved in the substrate and the coated layers. Adaptive lithography is used to create the desired pattern of waveguides (20) and other deflecting optical elements (23, 25) within the core layer to correspond with the positions of the optical and electronic devices relative to the substrate.
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