发明名称 POLISHING BODY, POLISHER, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
摘要 <p>A hard polishing pad made of a nonfoaming material and used for a CMP machine. In the surface of the polishing pad, a spiral groove or concentric grooves and grid grooves are combinedly made. The angles at which the grooves intersect are two degrees or more. There are no edges having a radius of curvature of 50 νm or less on the surface. Consequently, no burrs are produced, and the object being polished is not scratched, thereby improving the polishing rate.</p>
申请公布号 WO2000059680(P1) 申请公布日期 2000.10.12
申请号 JP2000001544 申请日期 2000.03.14
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