High speed die transfer system and method

摘要

A system 10 for automatically transferring a plurality of devices onto a plurality of circuits comprises a main drum 22 for feeding a continuous substrate 20 comprising a plurality of circuits 14.1 to 14.n provided thereon. The circuits collectively provide a first set of positions being respective device placement positions for receiving devices. A device transfer drum 34 cooperates with the main drum to transfer the devices onto the substrate in a device transfer region 48. The device transfer drum comprises means for carrying the devices in a second set of positions, respective ones of the first set of positions being associated with respective ones of the second set of positions. The system also comprises drive means 31 for driving the main drum 34 and the device transfer drum such that sequential positions in the first set of positions are in register with their associated positions in the second set of positions in said device transfer region, to transfer the devices onto the substrate in the respective device placement positions. <IMAGE>