| 摘要 |
<p>A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum alloy is then formed on the diffusion inhibiting layer. During the HIP bonding step, an insert composed of an aluminum-magnesium or aluminum-silicon-magnesium alloy is juxtaposed between the outer aluminum layer of the pre-treated copper alloy member and the beryllium member. <IMAGE></p> |
