HYBRID CIRCUIT WITH A HEAT DISSIPATION SYSTEM

摘要

A hybrid circuit with a heat dissipation system includes a terminal arrangement wherein at least one of the connecting pins (5) to solder the hybrid circuit (1) on a printed board has a heat transition resistance to the hybrid circuit (1), which is greater in relation to the other connecting pins (2) in such a way that the connecting pin (5) does not reach the melting temperature of the solder used at a given power level.