| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing a semiconductor, which shows a flame retardance without containing any halogen or antimony, exerts a good moldability and has a highly reliable reflow resistance, water vapor resistance and high-temperature properties, and an electronic component device. SOLUTION: An epoxy resin molding material for sealing essentially comprises (A) an epoxy resin having two or more epoxy groups per molecule, (B) a hardener, (C) an accelerator and (D) an inorganic filler, wherein the hardener (B) contains a polycondensate (E) of a phenol resin (a), a triazine derivative (b) and an aldehyde group-containing compound (c). An electronic component device is equipped with an element which is sealed with this epoxy resin molding material for sealing.
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