| 发明名称 |
Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| 摘要 |
A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.
|
| 申请公布号 |
US6129990(A) |
申请公布日期 |
2000.10.10 |
| 申请号 |
US19980193461 |
申请日期 |
1998.11.17 |
| 申请人 |
R. E. SERVICE COMPANY, INC. |
发明人 |
FRATER, MARK S. |
| 分类号 |
H05K3/02;(IPC1-7):B32B15/01 |
主分类号 |
H05K3/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
