发明名称 HOT MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot melt adhesive having excellent adhesiveness, low melt viscosity and excellent coating workability even in using at a relatively low temperature, excellent heat stability and excellent handling workability without tackiness in manufacturing. SOLUTION: This adhesive composition is obtained by melt blending an S-B-S or S-EB-S block copolymer, an S-I-S or S-EP-S block copolymer and an S-I or S-EP linear diblock type block copolymer. Otherwise, an S-I-S or S-EP-S block copolymer and an S-B or S-EB linear block type block copolymer are melt blended. Here, S is polystyrene block, B is butadiene block, I is isoprene block, EB is hydrogenated butadiene block and EP is hydrogenated isoprene block.
申请公布号 JP2000282006(A) 申请公布日期 2000.10.10
申请号 JP19990138728 申请日期 1999.05.19
申请人 SEKISUI CHEM CO LTD 发明人 YONEDA YOSHIKAZU;HONDA JUNICHI
分类号 C09J153/02;(IPC1-7):C09J153/02 主分类号 C09J153/02
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