| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate having heat fusibility, excellent in antistatic capacity and transparency even under low humidity environment, and a package produced by the thermal fusion processing of the laminate. SOLUTION: A laminate is obtained by laminating a heat seal layer on one surface of a resin film substrate layer and a conductive layer on the other surface thereof and the conductive layer contains an acicular conductive filler. The conductive layer is formed by coating the substrate layer with a binder resin having acicular antimony doped tin oxide, wherein a major axis particle size is 0.2-2.0μm, a minor axis particle size is 0.01-0.02μm and a particle size ratio of major axis/minor axis is 20-30, dispersed therein. Since the conductive layer contains fine acicular antimony doped tin oxide, stable and good conductivity not depending on humidity can be developed in the laminate. Since particles of antimony doped tin oxide are easy to contact with each other even in a reduced addition amt. as compared with a case using a conventional spherical conductive filler, this laminate is excellent in transparency.
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