SILICON RESIN AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME

摘要

PROBLEM TO BE SOLVED: To provide a silicone photosensitive resin exhibiting excellent performances as a resist material for a multilayer resist method or as a resist material for forming a PDP barrier, particularly to provide a resist material excellent in resistance to plasma (resistance to O2-RIE) and capable of realizing a high aspect ratio when used for pattern formation. SOLUTION: This silicone resin comprises a polyorganosilsesquioxane having a triorganosilyl group represented by the formula (wherein R is a divalent organic group and R' is a divalent group or a direct bond) bonded to all or a part of its molecular chain ends. Further, another objective photosensitive resin composition comprises the silicone resin and an acid-generating agent admixed therewith.