| 摘要 |
PURPOSE:To improve the workability of the assembling process and provide an inexpensive ion sensor by integrally constituting a reinforcing plate and a flexible printed circuit board(FPCB) provided with a bump electrode for connecting a sensor chip. CONSTITUTION:A bonding bump electrode 10a and an ion-sensitive section 10b are formed on a sensor chip 10 in advance, and a bump electrodes 4, 10a are connected in a chip fitting window 8. Insulating resin is filled so that the sensitive section 10b region of the chip 10 is exposed and the opening window 8 of a reinforcing plate 7 is buried, and a sheet-shaped sensor is realized. The reinforcing plate 7 is stuck to an FPCB when an ISFET chip is bonded, and bonding positioning can be performed correctly and automatically when the size of the opening window 8 of the reinforcing plate 7 is adjusted. A metal pseudo electrode 14 is buried in a case 13 filled with saturated KCl gel 12, and the sheet-shaped sensor is integrally formed into contact with a liquid junction. |
