| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a process control, moreover to roughen the surface of copper or a copper alloy and to improve the adhesive strength with a prepreg or the like by composing the etching agent of an aq. soln. contg. a main agent composed of an inorganic acid and an oxidizer for copper and an assistant composed of at least one kind of azoles and at least one kind of etching inhibitor. SOLUTION: Preferably, the inorganic acid is composed of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, chloric acid, sulfamic acid, boric acid or boric-hydrofluoric acid, the oxidizer for copper is composed of hydrogen peroxide, ferric chloride, cupric chloride or a peroxo compd., the azoles are composed of diazole, triazole, tetrazole or their derivatives, the etching inhibitor is composed of phosphorous acid, hypophosphorous acid, pyrophosphoric acid or their salts, an organic compd. having a phosphonic group, pyridine, a pyridine derivative, an aromatic compd. having an amino group, a saturated ring compd. having a nitrogen atom or a compd. having a sulfur atom.
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