| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition capable of developing, when cured, low moisture absorptivity, soldering stress resistance, and very excellent wet soldering resistance by mixing stilbene-derived epoxy resin with a curing agent containing anα-naphthol aralkyl resin in a specified ratio, an inorganic filler, and a cure accelerator in a specified ratio. SOLUTION: This composition is prepared by mixing a stilbene-derived epoxy resin of formula I with a curing agent containing 30-100 wt.%, based on the curing agent,α-naphthol aralkyl resin of formula II and used in such an amount that the ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl group of the curing agent is 0.5-2 by equivalent, an inorganic filler, and a cure accelerator. In formula I, R1 to R8 are each H, a 1-5C alkyl, or a halogen; and in formula II, (n) is 1-10. The inorganic filler and the cure accelerator are used in amounts of 250-1,400 pts.wt. and 0.4-20 pts.wt. per 100 pts.wt. total of the epoxy resin and the curing agent. The inorganic filler used is particularly desirably spherical silica.
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