发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition capable of absorbing and reducing formaldehyde released from a processed product processed by using a formaldehyde-based resin adhesive while ensuring an adhering property. SOLUTION: This adhesive composition effectively absorbs formaldehyde diffused from a wood processed product, a building material, etc., using an adhesive composition of a formaldehyde-based adhesive in which 100 pts.wt. of a vinyl acetate-based polymer emulsion and 3-20 pts.wt. of a urea-based compound are added, and therefore, the composition can resolve the problem such as headache or allergy induced by diffusion of formaldehyde.
申请公布号 JP2000282003(A) 申请公布日期 2000.10.10
申请号 JP19990087366 申请日期 1999.03.30
申请人 AICA KOGYO CO LTD 发明人 ISOBE SATORU;KUSHIDA MITSUGI;SUGIURA HIROSHI
分类号 C09J131/04;(IPC1-7):C09J131/04 主分类号 C09J131/04
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