| 摘要 |
PROBLEM TO BE SOLVED: To neatly perform a thermal pressure-bonding process by applying heat and pressurizing a member to be bonded under pressure with a projecting part and a film which are superposed over each other using a first heating roller and the member to be bonded under pressure with no projecting part and the film which are superposed over each other using a second heating roller and further, thermally pressure-bonding all of these members and films. SOLUTION: When a thermal pressure-bonding process is applied to a reverse sheet of a cover with a projecting part, a first heating roller 14 is selected and the sheet is inserted into a thermal pressure-bonding device with a protecting film disposed on the device. When the reverse sheet with no protecting film is subjected to the thermal pressure-bonding process, a second heating roller 15 is selected and the sheet is inserted into the device with the sheet disposed on the device. CPU controls so that a booklet and the protecting film inserted into the device are conveyed by conveying rollers 11, 12 and the protrusions 14e, 15e of the first and the second heating roller 14, 15 come into contact with the end parts of the reverse sheet of a cover of the booklet and executes the thermal pressure-bonding operation. Thus it is possible to neatly perform the thermal pressure-bonding process using a single unit of the device.
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