发明名称 SYSTEM FOR GRASPING BEHAVIOR OF DEVICE FOR WORKING SEMIPLASTIC BODY
摘要 PROBLEM TO BE SOLVED: To enhance productivity of an ALC panel by facilitating adjustment of an installation. SOLUTION: In the system for grasping behavior in the device for working the semiplastic body, data sampling speed is less than one second for one point by control of a data accumulation part 50. Displacement amount of a measurement point in the device for working the semiplastic body is measured by a displacement gage which is arranged in the prescribed position and has measurement precision of 0-0.1 mm. The data accumulation part 50 collects an elapsed time and data of measured displacement amount and sends them to a computer as data readable by the computer 60. The computer forms a waveform graph on the basis of the data. In this case, measurement is desirably performed in a plurality of times and also the generation rate of damage is inputted in accordance with the respective waveform graphs based on the respectively measured results in the computer 60. The waveform graphs in which the generation rate of damage is minimum, are set as a standard waveform graph. The waveform graphs based on the measured result are compared with the standard waveform graph and analyzed.
申请公布号 JP2000280228(A) 申请公布日期 2000.10.10
申请号 JP19990091286 申请日期 1999.03.31
申请人 SUMITOMO METAL MINING CO LTD 发明人 NAKAMURA KAZUYOSHI;KACHI ISAMU
分类号 B28B1/50;B28B11/14;B28B17/00;(IPC1-7):B28B17/00 主分类号 B28B1/50
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