发明名称 ADHESIVE FOR SUBSTRATE OF BUILDING AND WALL STRUCTURE OF BUILDING
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive which is used for the substrate used in a building, can thin a surface layer (adhesive layer) for finishing materials and can give a waterproof and flexible structure, when the finishing materials such as tiles are attached to the surfaces of heat-insulating plates such as foamed polystyrene plates. SOLUTION: This adhesive for the substrates of buildings is produced by adding and mixing sand (about 65 wt.%) and a cement to a water-soluble vinyl acetate-based acrylic acid (about 35 wt.%) with stirring. A wall structure 7 is formed by coating the surfaces 1a of the heat-insulating plates 1, 1 on a concrete wall (body) having the heat-insulating plates 1, 1 adhered thereto with an adhesive for the substrates of the building in a thickness of about 3 to 5 mm, pressing and adhering tiles 5, 5 to the formed adhesive layer 4, and then filling the joint portions 6 with a joining material.
申请公布号 JP2000281414(A) 申请公布日期 2000.10.10
申请号 JP19990093062 申请日期 1999.03.31
申请人 ZIPANGU SAKURA TRADING:KK 发明人 MARK WATERS
分类号 E04F13/21;C04B26/04;C04B26/06;(IPC1-7):C04B26/06;E04F13/08;E04F13/14 主分类号 E04F13/21
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