发明名称 |
Solderable structures |
摘要 |
Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.
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申请公布号 |
US6129260(A) |
申请公布日期 |
2000.10.10 |
申请号 |
US19980136846 |
申请日期 |
1998.08.19 |
申请人 |
FRAVILLIG TECHNOLOGIES COMPANY |
发明人 |
ANDRUS, LANCE;FRAIVILLIG, JAMES;BARRETT, EDWARD;HIGH, BRIAN |
分类号 |
B23K1/00;(IPC1-7):B23K31/02;H05K3/38 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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