| 摘要 |
PROBLEM TO BE SOLVED: To obtain a new compound optionally containing a phenolic group, alkoxysilyl group, alkenyl group or silanol group in the identical molecule and capable of imparting the cured product of a curable silicone composition with a good adhesiveness to an organic resin such as phenolic resin, a metal such as copper and a glass. SOLUTION: This new compound is a compound of formula I [A is a residue resulting from excluding n OH group(s) of a m-hydric alcohol or H; Y is a group of formula II (R3 is an alkyl; q is 0-4); R1 is a >=2C bivalent hydrocarbon; R is a monovalent hydrocarbon containing no aliphatic unsaturated bond; m and n are each a natural number and m>=n; p is 0 or 1], for instance, a compound of formula III. The compound of formula I is obtained by intramolecular or intermolecular addition-reaction of a compound of formula IV (R2 is a monovalent hydrocarbon containing aliphatic unsaturated bond) (e.g. a compound of formula V) in the presence of a catalyst for hydrosilylation reaction such as platinum vinylsiloxane complex followed by reacting a compound of the formula A(OH)n (e.g. allyl alchol) or water.
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