| 摘要 |
PCT No. PCT/JP97/03707 Sec. 371 Date Jun. 16, 1998 Sec. 102(e) Date Jun. 16, 1998 PCT Filed Oct. 15, 1997 PCT Pub. No. WO98/18163 PCT Pub. Date Apr. 30, 1998A film carrier tape provides reduced occurrence of lead bending during the making process, and allows a chip-size package to be made with high reliability, while increasing the yield. The extremities of TAB leads (54a, 54b) are not connected to a frame (59), but are formed as free ends from the time of formation of the pattern, and are not subject to any process at all until the final bonding process. On the other hand, a plurality of link portions (57a to 57j) are provided within the mounting area of a semiconductor chip, linking many of leads within the mounting area of an IC chip, and through these link portions connecting them to a frame.
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