| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject sheet which can prevent scattering, on dicing, chips on an electronic substrate even when the substrate has an eveness of 1-5 mm and further does not to cause glue remains, due to its secure and close adhesion to the electronic substrate. SOLUTION: A sheet for fixing an electronic substrate comprises a sheetform, phototransmissible base material and a pressure-sensitive adhesive layer laminated on one side of the base material. The base material has a 25% modulus of 0.5-1.2 kgf/20 mm, and a thickness of 70-300μm. The pressure-sensitive adhesive layer comprises 100 pts.wt. of a base polymer, 3-100 pts.wt. of an ultraviolet ray-polymerizable resin and 0.1-5 pts.wt. of an ultraviolet ray-polymerization initiator. The pressure-sensitive adhesive layer has a thickness of 10-50μm.
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