发明名称 |
Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
摘要 |
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, the functional copper foil being electro-deposited with a uniform thickness of more than 4 mum but less than 10 mum on the carrier foil, the functional copper foil having a front side facing the carrier foil and an opposite backside which is coated with the non-reinforced thermosetting resin layer. The method further involves laminating the composite foil with the non-reinforced thermosetting resin layer on the core board and removing the carrier foil from the functional copper foil in order to uncover the front side of the functional copper foil. A CO2 laser source drills holes from the uncovered front side of the functional copper foil through the functional copper foil and the non-reinforced thermosetting resin layer to form microvias. |
申请公布号 |
AU4108300(A) |
申请公布日期 |
2000.10.09 |
申请号 |
AU20000041083 |
申请日期 |
2000.03.23 |
申请人 |
CIRCUIT FOIL LUXEMBOURG TRADING S.» R.L. |
发明人 |
RAYMOND GALES;DAMIEN MICHEL |
分类号 |
H05K3/00;H05K3/02;H05K3/38;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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