| 摘要 |
The present invention provides a multilayered polyamide film having at least two polyamide resin layers, which develops less than 10 pinholes when evaluated for pinhole resistance by flexing it 1,000-times at 25 DEG C and which has an elongation of 6 mm or less at 120 DEG C in vertical pitch evaluation. This film has excellent resistance to pinholes and is well suited for lamination. |
