发明名称 WIRE BONDING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To control the height of a wire loop, with which the first bonding point and the second bonding point are connected, in a highly precise manner. SOLUTION: The closing of a clamper 5 is controlled in the suitable timing wherein a capillary 4 descends from the top ascending position of the first bonding point to the second bonding point describing a circular arc. As a result, the irregularity in the height of the loop form of the wire 3, which connects between the first bonding point and the second bonding point, can be suppressed by properly adjusting the amount of loosening of the wire 3 in the capillary 4, and the height of a wire loop can be controlled in a highly precise manner.
申请公布号 JP2000277558(A) 申请公布日期 2000.10.06
申请号 JP19990084338 申请日期 1999.03.26
申请人 SHIBAURA MECHATRONICS CORP 发明人 YAMANAKA YASUYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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