发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION OF PATTERN, AND ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To obtain a positive photosensitive resin compsn. having excellent sensitivity and resolution by incorporating a specified polyphenylene oxide and a compd. which produces an acid by light. SOLUTION: The resin compsn. contains a polyphenylene oxide having the recurring unit expressed by the formula and a compd. which produces an acid by light. In the formula, R1 is a halogen atom or 1-9C alkyl group, and when a plurality of R1 are present, each may be same as or different from others, and x is an integer 0 to 3. The mol.wt. of the polyphenylene oxide is preferably 4,000 to 100,000 weight average mol.wt. from the viewpoint of physical properties of the film, and more preferably 10,000 to 40,000. The compd. which produces the acid by the light has functions to produce the acid by irradiation of the light and to enhance the solubility of the irradiated region by the light with an alkali soln. As for the kinds of the compd., for example, photosensitive diazoquinone compds., aryl diazonium salts, diaryl iodonium salts, triaryl sulfonium salts or the like can be used.
申请公布号 JP2000275842(A) 申请公布日期 2000.10.06
申请号 JP19990083493 申请日期 1999.03.26
申请人 HITACHI CHEM CO LTD 发明人 TSUCHIKAWA SHINJI;KAJI MAKOTO;UEDA MITSURU;TAKESHI KAZUMASA;OKUYAMA KENICHI
分类号 H01L21/027;G03F7/004;G03F7/039 主分类号 H01L21/027
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