| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding method and a device, where a defective caused by misalignment is prevented from being sent to an after process, and a card base material can be thermally less deformed. SOLUTION: A bonding device 10 transfers an IC module 25 to an IC card base material and fixes the module 25 to the base material by heating, where the bonding device 10 is equipped with tapered pins 28 which are inserted into perforations provided to an IC module to position a module tape 25a, a die equipped with an optical sensor which detects misalignment of the module tape 25a, a heater 48 which holds the IC module 25 and heats it, and a heating head 47 which is equipped with a control means 50 that enables a heater 48 to preheat the IC module 25 while the IC module 25 is transferred so as to activate the adhesive sheet of the IC module 25.</p> |
