CIRCUIT SUBSTRATE HOLDING METHOD, CUTTING METHOD AND COMPONENT REMOVING METHOD AND PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To disassemble various electronic components mounted with soldering on a printed circuit board and collects substrate, solder and electronic components through sorting. SOLUTION: This circuit substrate cutting method comprises a process for dipping a circuit substrate 300 into a fluid floor forming member 212 in fluid state, a process for keeping the circuit substrate 300 at the fluid floor by stopping the flow of the fluid floor forming member 212 and a process to cut at least one of the circuit substrate 300 or the parts mounted on the circuit substrate 300.