发明名称 METHOD OF BONDING HEAT SINK, AND HEAT SINK FRAME THEREFOR
摘要 PROBLEM TO BE SOLVED: To improve production efficiency in the ultrasonic bonding of a heat sink to the back of pads on a lead frame. SOLUTION: A heat sink frame 8a is set crosswise above a lead frame 1a, a pad 3 of an arbitrary lead frame 1 is aligned with a heat sink 8 corresponding thereto, a pressure tool 14 contacts the heat sink 8 to apply an ultrasonic vibration, so as to ultrasonically bond the pad 3 to the heat sink 8, while the heat sinks 8 are separated individually from a connection frame 18 by the ultrasonic vibration.
申请公布号 JP2000277675(A) 申请公布日期 2000.10.06
申请号 JP19990077151 申请日期 1999.03.23
申请人 MITSUI HIGH TEC INC 发明人 TONE KEIICHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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