| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion of bumps formed on a plurality of electrodes to resin, by forming a portion depressed inwardly from the top end on the side of each bump except its top end. SOLUTION: A semiconductor chip 10 with a part of conductive wire 16 bonded to an electrode 12 is placed on a base 20 and then a pressing jug 22 crushes the part of the conductive wire 16 to form a bump 24. The bump 24 is constituted by a top end 26, a center portion 27, and a bottom end portion 28. The top end 26 includes a portion formed by crushing the part of the cut conductive wire 16 and its top surface is made flat. A portion 29 depressed inwardly from the side of the top end 26 is formed on the side of the bump except the top end 26. This can increase an adhesive force and prevent the bump 24 from separating from resin. |
