发明名称 MANIFOLD INCORPORATING THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a manifold incorporating a thermoelectric module in which heat exchanging efficiency is enhanced by regulating the flow rate of heat carrier. SOLUTION: In a manifold 1 incorporating a thermoelectric module 7, heat exchanging efficiency is enhanced by differentiating the flow rate of heat carrier on the cooling side from the flow rate of heat carrier on the heating side. In order to lower the temperature of heat carrier on the cooling side, channel resistance in the manifold 1 is designed such that the flow rate of heat carrier on the heating side is lower than the flow rate of heat carrier on the cooling side. When pump components, e.g. impellers 5, 6 constituting a volute pump, are incorporated, heat carrier delivery capacity of the pump components is designed.
申请公布号 JP2000274873(A) 申请公布日期 2000.10.06
申请号 JP19990076940 申请日期 1999.03.19
申请人 MATSUSHITA REFRIG CO LTD 发明人 KAMITSUJI TOSHIO;INAMORI SHOHEI;KIDO OSAO;MORISHITA KENICHI;FUJIMOTO SHINJI
分类号 F04D17/10;F25B21/02;(IPC1-7):F25B21/02 主分类号 F04D17/10
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