发明名称 THERMOELECTRIC UNIT AND THERMOELECTRIC MANIFOLD
摘要 PROBLEM TO BE SOLVED: To obtain a thermoelectric manifold having a plurality of stages of thermoelectric module in which heat exchanging efficiency is enhanced by making the heat distribution uniform on the heat absorbing surface and the heat radiating surface and heat is transferred well between thermoelectric modules even when the thermoelectric module is bent by suppressing thermal stress thereof. SOLUTION: The thermoelectric unit comprises a plurality of thermoelectric modules 7 each having a heat absorbing surface 7a and a heat radiating surface 7b which are cooled and heated, respectively, upon current supply. The plurality of thermoelectric modules 7 are juxtaposed in a manifold body 19 such that the heat radiating surface 7b of one thermoelectric module 7 faces the heat absorbing surface 7a of an adjacent thermoelectric module 7. In the manifold body 19, a cooling cavity 20c is provided for the heat absorbing surface 7a on the cooling end side, a heating cavity 10d is provided for the heat radiating surface 7b on the heating end side, and a heat transfer cavity 17a is provided between adjacent thermoelectric modules 7.
申请公布号 JP2000274871(A) 申请公布日期 2000.10.06
申请号 JP19990076937 申请日期 1999.03.19
申请人 MATSUSHITA REFRIG CO LTD 发明人 KAMITSUJI TOSHIO;INAMORI SHOHEI;KIDO OSAO;MORISHITA KENICHI;FUJIMOTO SHINJI
分类号 F25B21/02;(IPC1-7):F25B21/02 主分类号 F25B21/02
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