发明名称 HIGH FREQUENCY CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To simply connect a microstrip line and a coplanar line at a low cost without the need for throughholes having been required for conventional technologies with a small scale configuration. SOLUTION: The high frequency printed circuit board is configured such that conductor lines 2A, coplanar lines 10A with a GND electrode 3A each provided to each side of the conductor lines and a microstrip conductor line 6A are placed on a dielectric substrate 1A, the conductor lines 2A of the coplanar line are connected to the microstrip conductor lines 6A, a dielectric thin film 4 is placed on the entire face of the microstrip conductor, a GND electrode 3B is provided on the entire face of the dielectric thin film, a microstrip line 11A consists of the microstrip conductor lines, the dielectric film and the GND electrode and the GND electrode 3B of the microstrip line is connected to the GND electrode 3A of the coplanar line.
申请公布号 JP2000278007(A) 申请公布日期 2000.10.06
申请号 JP19990078647 申请日期 1999.03.23
申请人 KOKUSAI ELECTRIC CO LTD 发明人 KANDA TADASHI
分类号 H05K1/02;H01P5/08;(IPC1-7):H01P5/08 主分类号 H05K1/02
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