| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder from sticking to the through hole of a part land by providing a hot-melt resin coating layer on the component and the soldering surface of a printed wiring board so that all the terminal through holes of the land provided at the printed wiring board is covered. SOLUTION: A printed wiring board 1 is provided with lands 3, and hot-melt resin coating layers 5 and 6 are formed on both component and soldering surface of the printed wiring board so that all the through holes of the lands 3, or terminal through holes 4 are covered. Since, in an automatic soldering process, the terminal through holes 4 of the lands 3 for mounting later soldering component are masked with the resin coating layers 5 and 6, a solder is prevented from sticking to the terminal through holes 4 of the lands 3 for mounting later soldering component.
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