| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball grid array(BGA) package in which shortcircuiting between terminals can be prevented. SOLUTION: A BGA package 10 is provided with a resin substrate 11, on which a semiconductor chip (not shown) is loaded, a mold resin 13 for sealing a semiconductor chip which is formed on the upper face of the resin substrate 11, plural terminals 12 constituted of balls which are formed on the lower face of the resin substrate 11, and protrusions 14 formed on the lower face of the resin substrate 11. The protrusions 14 are formed in the surrounding of the lower face of the resin substrate 11 so that the terminals 12 can be surrounded, and the height of the protrusion 14 is set so as to be lower than that of the terminal 12. As the material, resin substrate is used.
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