| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer ring exchanging device which is capable of enhancing the operation efficiency in a die bonder. SOLUTION: A wafer ring 2 is taken out of a wafer rack 3, placed on a hot plate 5, and heated. The wafer ring 2 is dismounted from a wafer holder 21 after bonding and kept on standby at a plate upper standby site 8 above the wafer rack 3, The wafer ring 2 on the hot plate 5 is mounted on the wafer holder 21, a wafer sheet 7 is expanded by an expander, and a bonding operation is started. The wafer ring 2 on standby is placed on the hot plate 5 to shrink the wafer sheet 7 and then housed in the wafer rack 3.
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