发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND CONDUCTIVE PASTE THEREOF
摘要 PROBLEM TO BE SOLVED: To cause less cracks and delaminations to occur within a laminate by increasing adhesion between ceramic layers within the laminate. SOLUTION: A multilayer ceramic electronic component has a laminate 3, wherein each of ceramic layers 7 is alternately interposed between internal electrodes 5 and 6 external electrodes 2 and 2 provided at ends of the laminate 3 and connected to the electrodes 5 and 6, respectively. There are present in the electrodes 5 and 6 first ceramic particles, whose average particle size is equal to or smaller than that of conductor particles of which the electrodes 5 and 6 are composed, and second ceramic particles, whose average particle size is greater than the thickness of the electrodes 5 and 6. Conductive paste for forming the electrodes 5 and 6 is prepared, by adding a first of ceramic powder whose average particle size is equal to or smaller than that of the conductor particles, and a second ceramic powder, whose average particle size is greater than that of the conductor particles.
申请公布号 JP2000277369(A) 申请公布日期 2000.10.06
申请号 JP19990085288 申请日期 1999.03.29
申请人 TAIYO YUDEN CO LTD 发明人 YAGI JUNICHI
分类号 H01G4/12;H01F41/04;H01G4/008;H01G4/30;H01L41/047;H01L41/083;H03H7/01;(IPC1-7):H01G4/12 主分类号 H01G4/12
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