| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect wafers against damage caused by contact between their tips by a method wherein a distance between a first intersection and a second intersection of the peripheral edge of the wafer is set equal to the support length of the wafer, and the inner wall of a groove is tilted at a specific angle of inclination with the reference plane of the groove nearly vertical to the base of a carrier. SOLUTION: The wafers 1 are inserted and held in grooves 3, a gap between the tips of wafers 1 opposite to the base of a carrier is represented by G, and a first coefficient determined by the surface tension of the wafers 1 and the rigidity of the wafers 1 is represented byα. Provided that a distance between a first intersection X1 at which the peripheral edge of the wafer 1 intersects the uppermost part of the groove 3 most distant from its base and a second intersection X2 at which the peripheral edge of the wafer 1 intersects the lowermost base of the groove 3 is defined as a wafer support length H1, the inner wall of the groove 3 is tilted at an angleθof inclination with the reference plane of the groove 3 nearly vertical to the base of a carrier, whereθis represented by a formula,θ=G/(2×H1×α).</p> |
