| 摘要 |
<p>PROBLEM TO BE SOLVED: To accurately inspect a soldered state of an electronic component by simultaneously measuring and using three-dimensional data and laser irradiated luminance data by laser scanning. SOLUTION: Three-dimensional data and laser irradiated luminance data are obtained by three-dimensional measuring a preset inspecting area and measuring its luminance. Then, an edge detecting threshold value is input. Areas a to e including an electronic component edge are laterally set at a center of the component. A difference (a-b) of three-dimensional data between the adjacent two points a and b is obtained. Then, the difference (a-b) is compared with an edge detecting threshold value in the areas a to e. If the (a-b) > (the threshold value) is satisfied, coordinates of the point b then are used as a reference position. Then, an offset value is input. The value is a distance from the reference position to a position on a fillet having correlation with a luminance level. Then, a luminance threshold value is input. Further, a rectangular luminance calculating area is set to a position separated by an offset value from the reference position, and the luminance level is obtained based on the initial luminance data. Then, the level is compared with the threshold value, and a good electronic component or not is decided.</p> |
