| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which junction strength on a mounting substrate can be enhanced, underflow materials can be dispensed with, highly accurate and strong ribs can be obtained relatively easily, and the creeping of hot air to a solder bump side cannot be interrupted at the time of reflow. SOLUTION: Plural ribs 15 are arranged at the outer peripheral parts of an interposer 11 and interval parts between the columns of solder bumps 14. As a result, the joint strength of a ball grid array (BGA) 10 after mounting can be increased. Thus, it is not necessary to provide an underfill member. Each rib 15 is integrate with the interposer 11. Therefore, highly accurate and strong ribs 15 can be obtained relatively easily. The ribs 15 are in parallel to each other. As a result, the creeping of heat at the reflow to the bump 14 side cannot be interrupted. Thus, the generation of junction nonconformities due to the non-transfer of the hot air to each solder bum 14 on the other face of the interposer 11 can be eliminated. |
